Bonding wire of Ag unique characteristics.
Rapidly adapted by IC and LED market latest years. There is no concern about silver migration because of the less number of terminals. Addition to that the market price of it is one forth of gold price. We expect the application of it will increase.
Ag Alloy Wire
- Suitable for various application
- Stable bondability performance same level as Au wire bonding
- Supress chip damage during bonding.
- Good BSOB performance.
- Variation of Ag purity such as 92%, 96%, 97%, and 99%, according to your application and needs.
- Offers low resistivity wire, as low as 2.0 μΩ・cm.