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Company Profile

TATSUTA Electronic Materials Malaysia Sdn. Bhd. (TEMM), a subsidiary of the internationally renowned Tatsuta Electric Wire & Cable Co., Ltd. (Tatsuta) in Japan, has been conducting business in the Malaysia since its incorporation in 2012.
 
Tatsuta has a history of more than 35 years in the bonding wire business and has contributed to the production of high-quality semiconductors in Japan.  We, TEMM, brought Tatsuta’s high technology and quality to Malaysia and is manufacturing various bonding wires, such as bare Copper wire, Silver alloy wire, Pd coated Copper wire, Copper alloy wire.
 
TEMM has produced high quality bonding wires and we will continue to supply bonding wires with the customer-first spirit in Southeast Asia, China, Taiwan, which is one of the largest production base in the semiconductor industry.


One of TEMM’s main target is semiconductor for automotive. High reliability, quality, stable supply are required for Zero-Defect of semiconductor and stable operation of the customer’s factory.
TEMM strive to provide the stable supply of high-quality bonding wire to contribute to the high quality and stable supply of our customers.
 
TEMM can develop wires that meet the needs of our customers by unique technology.
  (1)   Alloying technology (ultra-high purity raw material, unique dopant…)
  (2)   Surface treatment technology 
  (3)   Heat treatment technology
  (4)   Production technology of ultra-fine wire.
 
We, TEMM, will continue to supply our customers with highly reliable and high-quality bonding wires and contribute to the development of the semiconductor industry.
 
And TEMM can supply our ultra-fine wire for industries other than semiconductors.
If you can use our ultra-fine wires for applications other than semiconductors, please feel free to contact us. We can develop suitable ultra-fine metal wire for its application

 

 Keyword : ultra-fine wire, ultra-high purity, high reliability, automotive, semiconductor  

 

Overview

 

Company Name Tatsuta Electronic Materials Malaysia Sdn. Bhd.
Registration No. 201201038888(1023366-P)
Establish 2012
Address No. 8 Jalan Pendaftar U1/54
Temasya Industrial Park, 40150
Shah Alam, Selangor, Malaysia
Parent Company Tatsuta Electric Wire & Cable Co., Ltd.
Main products Bonding wire for Semiconductor (Bare Copper, Palladium-Coated Copper, Silver Alloy, Copper Alloy)
Associated company TATSUTA Electric Wire and Cable Co., Ltd.
Chugoku Electric Wire & Cable Co., Ltd.
Tatsuta Tachii Electric Cable Co.,Ltd.
Tatsuta Environmental Analysis Center Co., Ltd.
Tatsuta Welfare Service Co., Ltd.
Changzhou Tatsuta Chugoku Electric Wire & Cable Co., Ltd.
Shanghai Tatsuta Co., Ltd.
Shanghai TATSUTA Co., Ltd Su Zhou Tech Center
Tatsuta USA, Inc.

 

ISO Certification

ISO 9001
ISO 14001
IATF 16949

 

ISO Registration

ISO14001 Registration

ISO14001 Registration
Registered organization Tatsuta Electronic Materials Malaysia Sdn. Bhd.
Scope of registration Manufacturing of Bonding Wires for Semiconductor Devices
Certificate number 44 104 14 92 0015
Registration date 4 June 2014
Certificate authority TUV NORD CERT GmbH

 

ISO9001 Registration

ISO9001 Registration
Registered organization Tatsuta Electronic Materials Malaysia Sdn. Bhd.
Scope of registration Manufacturing of Bonding Wires for Semiconductor Devices
Certificate number 44 100 132544
Registration date 20 November 2016
Certificate authority TUV NORD CERT GmbH

 

IATF16949 Registration

IATF16949 Registration
Registered organization Tatsuta Electronic Materials Malaysia Sdn. Bhd.
Scope of registration Manufacturing of Bonding Wires for Semiconductor Devices
Certificate number 44 111 160429
Registration date 26 September 2018
Certificate authority TUV NORD CERT GmbH