The newly established TATSUTA Electronic Materials Malaysia, which has manufacturing and engineering facilities for Cu bonding and Ag bonding wire to lead Company’s vision. We will provide the best supports and knowledge for our customers, as well as becoming the spear tip for TATSUTA to expand its bonding wire business to global market.The bonding wire plant and engineering facilities built together on the premises allow us to manufacture new products and proceed immediately to various test and analysis.
The newly constructed TATSUTA Technical Center, which has a research laboratory to lead the Company’s R&D efforts, will allow TATSUTA to evolve into an R&D-oriented enterprise that precisely meets customer demand, as well as planting the seeds of a brighter future.
TATSUTA engineers, conducting research in electricity, electronics, metallurgy, chemistry and optics, do their best to apply the research knowledge they have gained to explore fundamental technologies, production engineering and new businesses. The Company’s R&D functions are brought together at the research laboratory of the TATSUTA Technical Center. We will undertake collaborative research with materials manufacturers and universities, as well as with our customers.