Ag Bonding Wire

Bonding wire of Ag unique characteristics.
Rapidly adapted by IC and LED market latest years. There is no concern about silver migration because of the less number of terminals. Addition to that the market price of it is one forth of gold price. We expect the application of it will increase.

 

Ag Alloy Wire

Ag Alloy Wire
★High bond ability & No forming gas requirement
-Stable bondability performance equivalent to Au wire
-During making FAB, no forming gas requirement (N2 gas only)
★Low work hardening
-Ag wire work hardening is lower that Cu, supress chip damage during bonding.
★Good BSOB performance
★Variation of Ag purity
-We have various purity Ag wire 92-99%, we can suggest Ag wire according to your application and needs.
-Offers low resistivity wire, as low as 2.0 μΩ・cm.