Bare Cu Bonding Wire

In recent years, bare Cu bonding wire become the cost saving alternative of Au bonding wire due to the rise of gold price. Since 1987, Tatsuta always challenge the development of Cu wire technology for complex and sophisticated application in global market. Tatsuta Cu wire widely adopted mainly in automotive application, from discrete packages to IC packages.

Ag Bonding Wire

In recent years, Ag bonding wire rapidly expanding as IC and LED applications. Tatsuta Ag bonding wire contributes to improve LED brightness and has great reputation in LED industry. Ag bonding wire application is expected to spread in the near future.

Pd-Coated Cu Bonding Wire

Pd-coated Cu bonding wire have the characteristic of both Au and Cu bonding wire. This wire delivers the lower cost than Au bonding wire, and has better manufacturing control than bare Cu bonding wire.

Cu Heavy Bondingwire

Recently Cu heavy bonding wire began to be used in place of Al bonding wire, because chip material is changing from Si to SiC or GaN for high performance. Tatsuta's heavy Cu bonding wire shows high electrical conductivity and high cycle test performance.