Pd-Coated Cu Bonding Wire
Wide Bonding Window and High Reliability Cu bonding wire
Palladium plated copper wire delivers the lower cost than Au bonding wire and greater in manufacturing control than bare copper bonding wire.
FAB of TC-ZS-1 is very soft and it is good solution for chip damage or Al splash.
TC-A ; Ultra High Purity type (6NCu type)
★Ultra high purity (>99.9999%Cu) wire
- Softest FAB hardness
- High reliability (Ultra low contain S,Halogen & No P dopant)
- Softest FAB hardness
- High reliability (Ultra low contain S,Halogen & No P dopant)
TC-GE ; High Purity & Cost Effective Type (5NCu Type)
★High purity (>99.999%Cu) wire
- Soft FAB hardness
- High reliability (Low contain S,Halogen & No P dopant)
- Cost effective (compare with 6NCu)
- Soft FAB hardness
- High reliability (Low contain S,Halogen & No P dopant)
- Cost effective (compare with 6NCu)
TC-AR ; High Purity & Stable FAB Type
★Ultra high purity (>99.9999%Cu) raw material + dopant wire
- Stable FAB shape
- Soft FAB hardness
- High reliability (Ultra low contain S,Halogen)
- Stable FAB shape
- Soft FAB hardness
- High reliability (Ultra low contain S,Halogen)
TC-E & TC-ER ; Normal 4N Type
★Cost effective wire
- Low cost (compare with 6NCu & 5NCu)
- Lower electrical resistivity than Gold
- TC-ER; Stable FAB shape
- Low cost (compare with 6NCu & 5NCu)
- Lower electrical resistivity than Gold
- TC-ER; Stable FAB shape
Ultimate Soft Copper Heavy Wire for Power Devices
★Soft wire hardness
-Wire hardness of Tatsuta's Cu wire is soft. It shows good bond ability
★High electrical conductivity
-Compared to the conventional Aluminum bonding wire,Tatsuta’s Copper wire shows superior electrical conductivity.
★Higher thermal cycle test
-Tatsuta’s Copper wire shows 10~ times higher cycle counts than Aluminum wire in power cycle test.
-Wire hardness of Tatsuta's Cu wire is soft. It shows good bond ability
★High electrical conductivity
-Compared to the conventional Aluminum bonding wire,Tatsuta’s Copper wire shows superior electrical conductivity.
★Higher thermal cycle test
-Tatsuta’s Copper wire shows 10~ times higher cycle counts than Aluminum wire in power cycle test.
MCX ; High Reliability Copper Alloy Wire
★Ultra high purity (>99.9999%Cu) raw material + dopant wire
-Softer FAB than Pd Coated Cu wire.
-Stable FAB size
-Good 2nd bond ability
-High reliability (due to high purity & dopant)
-Softer FAB than Pd Coated Cu wire.
-Stable FAB size
-Good 2nd bond ability
-High reliability (due to high purity & dopant)
Ag Alloy Wire
★High bond ability & No forming gas requirement
-Stable bondability performance equivalent to Au wire
-During making FAB, no forming gas requirement (N2 gas only)
★Low work hardening
-Ag wire work hardening is lower that Cu, supress chip damage during bonding.
★Good BSOB performance
★Variation of Ag purity
-We have various purity Ag wire 92-99%, we can suggest Ag wire according to your application and needs.
-Offers low resistivity wire, as low as 2.0 μΩ・cm.
-Stable bondability performance equivalent to Au wire
-During making FAB, no forming gas requirement (N2 gas only)
★Low work hardening
-Ag wire work hardening is lower that Cu, supress chip damage during bonding.
★Good BSOB performance
★Variation of Ag purity
-We have various purity Ag wire 92-99%, we can suggest Ag wire according to your application and needs.
-Offers low resistivity wire, as low as 2.0 μΩ・cm.
TC-ZS-1 ; Pd-coated Cu Wire
★Soft FAB and Good 2nd Bond ability
-Less chip damage and Al splash
-Better bond ability than conventional bare Cu wire.
★High reliability & Long floor life
-Higher reliability & longer floor life than conventional bare Cu wire.
-Less chip damage and Al splash
-Better bond ability than conventional bare Cu wire.
★High reliability & Long floor life
-Higher reliability & longer floor life than conventional bare Cu wire.